Resin composition and molded product thereof

ABSTRACT

An object of the present invention is to provide a resin composition in which a surface resistivity and a volume resistivity actually measured in an antistatic region and an electrostatic diffusion region are equivalent to each other, and a remolded product produced by reutilizing a molded product which can hold the above properties. Specifically, disclosed is a resin composition comprising: 100 parts by weight of (a) a thermoplastic resin; 20 to 80 parts by weight of (b) a nonconductive fibrous inorganic filler having an average fiber diameter of not more than 15 μm; and 10 to 70 parts by weight of the total of (c1) a graphite and (c2) a graphite in which (c) graphite having an average particle diameter of 1 μm to 50 μm wherein each kind thereof has a different particle diameter; and at least one of differences in average particle diameter between two kinds thereof is not less than 5 μm.

TECHNICAL FIELD

The present invention relates to a resin composition excellent in staticdissipativity and antistaticity of plastic members used as householdappliance parts, electronic and electric parts, OA device parts, audioand imaging device parts and automobile parts, and molded productsthereof.

BACKGROUND ART

Thermoplastic resins are variously utilized as molding materials forhousehold appliance parts, electronic and electric parts, OA deviceparts, audio and imaging device parts and automobile parts.

Many of such thermoplastic resins accumulate static electricity becausethey are electric insulating materials. The accumulation of staticelectricity leads to dust adhesion and electrostatic discharge. Theaccumulation further causes very serious trouble such as breakage ofICs, transistors, circuit substrates and the like, which are vulnerableto static electricity.

Therefore, many modifications and ingenuities have been proposed such asimparting antistaticity to thermoplastic resin compositions havingelectric insulation by formulating them with conductive substances.

Conductivity-imparted noninsulating resin compositions have largelydifferent performances depending on electric resistivities thereof. Thecompositions are generally classified as follows by range of the surfaceresistivity.

-   (1) A conductive resin composition, which has a surface resistivity    of less than 1×10⁵ Ω/sq., and which causes severe static discharge    in contact with a charged object, and exhibits a high conductivity    (a low resistivity).-   (2) A static dissipative resin composition, which has a surface    resistivity of from 1×10⁵ to 1×10⁹ Ω/sq., which does not cause    severe static discharge in contact with a charged object, and    exhibits a conductivity dissipating the charge promptly, and which    does not have a conductivity enough to shield the static field.-   (3) An antistatic resin composition, which has a surface resistivity    of from 1×10⁹ to 1×10¹⁴ Ω/sq., and which has a conductivity capable    of preventing the charging of itself to some degree, but does not    have a conductivity enough to dissipate promptly static electricity    of a charged object.

Documents describe techniques to impart conductivity to various types ofthermoplastic resins by formulating the resins with various types ofconductive materials. For example, proposed are a resin composition inwhich conductive carbon black, natural scaly graphite and an inorganicfiller are formulated in a polyphenylene sulfide (for example, seePatent Document 1), a resin composition in which conductive carbonblack, graphite and a filler are formulated in a polyphenylene sulfideresin (for example, see Patent Document 2), a resin composition in whichcarbon fiber, graphite, a silane-based coupling agent and an epoxy resinare formulated in polyarylene sulfide, (for example, see Patent Document3), a resin composition in which zinc oxide whisker and the like areformulated in a thermoplastic resin (for example, see Patent Document4), a resin composition in which conductive carbon black and artificialgraphite are formulated in a thermoplastic resin (for example, PatentDocument 5), a resin composition in which conductive carbon black,graphite and an epoxy group-containing α-olefinic copolymer areformulated in a polyarylene sulfide (for example, see Patent Document6), a resin composition in which graphite is formulated in a liquidcrystal polyester (for example, see Patent Document 7), a resincomposition of a semiconductive film in which a conductive filler isformulated in a polyphenylene sulfide (for example, see Patent Document8), and a resin for a coil encapsulating material (see Patent Document9).

The noninsulating resin compositions having three electriccharacteristics described above are suitably selectively used from therange of the surface resistivity according to purposes and applications.Therefore, control of the electric resistivity is important in thetechnique to impart conductivity to resin compositions.

Especially the static dissipative resin composition and the antistaticresin composition have a largely different surface resistance value andvolume resistance value of molded products. The reason is because thesurface resistance value becomes less by receiving an influence of leakcurrent to the thickness direction of molded products. However, forplastic members, noninsulating resin compositions are desired which havea stable actually measured surface resistance value and volumeresistance value, both of which are nearly equivalent to each other. Forobtaining such resin compositions, the techniques described above do notwork enough.

Further, remolded products obtained by reutilizing molded products,runner sections, spool sections and the like at molding have a largelyvaried surface resistivities and a largely different surface resistancevalue and volume resistance value. For improving this point, thetechniques described above do not work enough.

Patent Document 1: Japanese Patent Application No. 62-172059

Patent Document 2: Japanese Patent Laid-Open No. 1-272665

Patent Document 3: Japanese Patent Laid-Open No. 1-254766

Patent Document 4: Japanese Patent Laid-Open No. 5-247351

Patent Document 5: Japanese Patent Laid-Open No. 7-286103

Patent Document 6: Japanese Patent Laid-Open No. 10-158511

Patent Document 7: Japanese Patent Laid-Open No. 2000-281885

Patent Document 8: Japanese Patent Laid-Open No. 2006-69046

Patent Document 9: Japanese Patent Laid-Open No. 2006-291076

DISCLOSURE OF INVENTION Problems to be Solved by the Invention

An object to be solved by the present invention is to provide anantistatic resin composition and a static dissipative resin compositionwhich have a stable surface resistance value and volume resistancevalue, both of which are equivalent to each other, and have littlevariation in the surface resistivity. Further, with respect to remoldedproducts obtained by reutilizing the molded products, an antistaticresin composition and a static dissipative resin composition which havea stable surface resistance value and volume resistance value, both ofwhich are equivalent to each other, and have little variation in thesurface resistivity, can be provided.

Means for Solving the Problems

The present inventors have exhaustively studied, to solve the problemsdescribed above, an antistatic resin composition and a staticdissipative resin composition in which conductive materials areformulated in a thermoplastic resin. As a result, the present inventorshave found that a resin composition in which a nonconductive fibrousinorganic filler and two or more kinds of graphite having differentaverage particle diameters are concurrently used exhibits a stablenoninsulating property, and further that remolded products obtained byreutilizing the molded products exhibit a similar noninsulatingproperty. This has led to the present invention.

That is, the present invention is as follows.

-   (1) A resin composition comprising:

100 parts by weight of (a) a thermoplastic resin;

20 to 80 parts by weight of (b) a nonconductive fibrous inorganic fillerhaving an average fiber diameter of not more than 15 μm; and

10 to 70 parts by weight of the total of at least two kinds of (c)graphite having an average particle diameter of 1 μm to 50 μm whereineach kind thereof has a different particle diameter; and at least one ofdifferences in average particle diameter between two kinds thereof isnot less than 5 μm.

-   (2) The resin composition according to item (1), wherein the (a)    component is a thermoplastic resin which is a crystalline resin    and/or a noncrystalline resin.-   (3) The resin composition according to item (2), wherein the    crystalline resin is any one of a polyolefin, a syndiotactic    polystyrene, a polyacetal, a polyamide, a polyester, a polyphenylene    sulfide, a polyether ether ketone, a liquid crystal polymer and a    fluororesin; and the noncrystalline resin is any one of a styrene    resin, a polycarbonate, a polyphenylene ether, a polysulfone, a    polyether sulfone, a polyarylate, a polyamide-imide and a polyether    imide.-   (4) The resin composition according to item (3), wherein the (a)    component is any one of a polyphenylene ether, a polyphenylene    sulfide and a liquid crystal polymer.-   (5) The resin composition according to item (3), wherein the (a)    component is any one of polymer alloys of a polyphenylene ether, and    a polyphenylene sulfide, a styrene resin, a polyolefin, a polyamide,    a polyester or a liquid crystal polymer.-   (6) The resin composition according to any one of items (1) to (5),    wherein the nonconductive fibrous inorganic filler of the (b)    component is at least one specie selected from the group consisting    of a glass fiber, an alumina fiber, a ceramic fiber, a gypsum fiber,    a potassium titanate whisker, a magnesium sulfate whisker, a zinc    oxide whisker, a calcium carbonate whisker, a calcium silicate    whisker and a wallastonite.-   (7) The resin composition according to any one of items (1) to (6),    wherein the nonconductive fibrous inorganic filler of the (b)    component is a glass fiber.-   (8) The resin composition according to item (7), wherein the    nonconductive fibrous inorganic filler of the (b) component is a    glass fiber having an average fiber diameter of from 4 μm to 10 μm.-   (9) The resin composition according to any one of items (1) to (8,)    wherein the two kinds of the (c) graphite are (c1) a graphite having    an average particle diameter of from 15 μm to 50 μm and (c2) a    graphite having an average particle diameter of from 1 μm to 10 μm.-   (10) The resin composition according to item (9), wherein (an    average particle diameter of the (c1) component)/(an average    particle diameter of the (c2) component) is from 3 to 10.-   (11) The resin composition according to item (10), wherein (a    formulation amount of the (c1) component)/(a formulation amount of    the (c2) component) is from 0.1 to 1.0.-   (12) The resin composition according to any one of items (1) to    (11), wherein the resin composition has a surface resistivity of    from 1×10⁵ Ω/sq. to 1×10¹⁴ Ω/sq.-   (13) The resin composition according to any one of items (1) to    (12), wherein the resin composition has an anisotropy of a    resistance value of from 0.3 to 1.5.-   (14) A molded product molded using the resin composition according    to any one of items (1) to (13).-   (15) A remolded product obtained by reutilizing a molded product    molded using the resin composition according to item (14).-   (16) A resin composition obtained by melt-kneading 100 parts by    weight of (a) a thermoplastic resin; 20 parts by weight to 80 parts    by weight of (b) a nonconductive fibrous inorganic filler having an    average fiber diameter of not more than 15 μm; and 10 parts by    weight to 70 parts by weight of the total of two kinds of (c)    graphite having an average particle diameter of from 1 μm to 50 μm    wherein each kind thereof has a different particle diameter, and a    difference in average particle diameter between the two kinds    thereof is not less than 5 μm.

Advantageous Effects of the Invention

The antistatic resin composition and the static dissipative resincomposition obtained in the present invention have little variation insurface resistivity and a stable surface resistance value and volumeresistance value which are actually measured, both of which areequivalent to each other. Therefore, molded products thereof have littlevariation in surface resistivity and a stable surface resistance valueand volume resistance value which are actually measured, both of whichare equivalent to each other. Further, remolded products obtained byreutilizing the molded products also have a similar noninsulatingproperty, which is very useful industrially.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram viewed from the above of a resistance measurementapparatus used in the present invention; and

FIG. 2 is a sectional diagram viewed laterally of the resistancemeasurement apparatus used in the present invention.

DESCRIPTION OF SYMBOLS

-   1 Main electrode-   2 Guard electrode-   3 Sample (molded product)-   4 Counter electrode

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, the present invention will be described in detail.

A thermoplastic resin of (a) a component is classified as a crystallineresin and a noncrystalline resin.

The crystalline resin is a resin having a crystal peak present inmeasurement by DSC (differential scanning calorimetric analyzer). Bycontrast, the noncrystalline resin is a resin having no crystal peakpresent in measurement by DSC.

As (a) the thermoplastic resins, one or more kinds thereof are selectedfrom either one of the crystalline resins and the noncrystalline resins.Or, a combination of one or more kinds of crystalline resins and one ormore kinds of noncrystalline resins is selected. Specific examples ofthe combination may include a crystalline resin/a crystalline resin, acrystalline resin/a noncrystalline resin and a noncrystalline resin/anoncrystalline resin. Their combined formulation ratio (weight percent)is preferably from 99/1 to 1/99. The formulation ratio can be alteredaccording to levels of desired heat resistance, solvent resistance andthe like.

Examples of the crystalline resins may include polyolefins, oxymethylenecopolymers, polyamides, polyesters, polyphenylene sulfides, polyetherether ketones, liquid crystal polymers, syndiotactic polystyrenes,polyacetals and fluororesins.

Examples of the noncrystalline resins may include styrene resins,polyphenylene ethers, polycarbonates, polysulfones, polyether sulfones,polyarylates, polyamide-imides and polyether imides.

Resins suitably used among the crystalline resins may includepolyolefins, polyamides, polyesters, polyphenylene sulfides, liquidcrystal polymers, syndiotactic polystyrenes, polyacetals and the like.

Polyolefins may include isotactic polypropylenes,poly(4-methyl-1-pentene), polybutene-1, high-density polyethylenes,ultrahigh-molecular-weight high-density polyethylenes, low-densitypolyethylenes, linear low-density polyethylenes, ultralow-densitypolyethylenes of less than 0.90 in density, and copolymers of two ormore kinds of compounds selected from ethylene, propylene and otherα-olefins, such as ethylene/propylene copolymers,ethylene/butene-1-copolymers, ethylene/octene copolymers,propylene/ethylene (random, block) copolymers, propylene/1-hexenecopolymers, propylene/4-methyl-1-pentene copolymers and the like.

Polyamides may include polyamide 6, polyamide 66, polyamide 46,polyamide 11, polyamide 12, polyamide 610, polyamide 612, polyamide6/66, polyamide 6/612, polyamide MXD (m-xylylenediamine)/6, polyamide6T, polyamide 6I, polyamide 6/6T, polyamide 6/6I, polyamide 66/6T,polyamide 66/6I, polyamide 6/6T/6I, polyamide 66/6T/6I, polyamide6/12/6T, polyamide 66/12/6T, polyamide 6/12/6I, polyamide 66/12/6I,poly(paraphenylene terephthalamide), poly(parabenzamide),poly(4,4′-benzanilide terephthalamide),poly(paraphenylene-4,4′-biphenylenedicarboxylic acid amide),poly(paraphenylene-2,6-naphthalenedicarboxylic acid amide),poly(2-chloroparaphenylene terephthalamide),paraphenylenediamine/2,6-dichloroparaphenylenediamine/terephthalic aciddichloride copolymers, polynonamethylene terephthalamide (9T nylon) andthe like.

Polyesters may include polyethylene terephthalates, polytrimethyleneterephthalates, polybutylene terephthalates and the like. Above all,polytrimethylene terephthalates and polybutylene terephthalates arepreferable.

Polyphenylene sulfides (hereinafter, abbreviated as PPS) contain arepeating unit of arylene sulfide represented by the general formula(Formula 1) described below. The content of the repeating unit ispreferably 50 mol %, more preferably 70 mol %, still more preferably 90mol %.[—Ar—S—]  (Formula 1)(wherein Ar represents an arylene group.)

The arylene groups may include, for example, a p-phenylene group, anm-phenylene group, a substituted phenylene group (as a substituent, analkyl group having 1 to 10 carbon atoms or a phenyl group ispreferable), a p,p′-biphenylene sulfone group, a p,p′-biphenylene group,a p,p′-diphenylene carbonyl group and a naphthylene group.

PPS may be a homopolymer having one specie of the arylene group. It maybe a copolymer having two or more different species of arylene groups inview of the processability and heat resistance. As the arylene group,linear polyphenylene sulfides having a p-phenylene group are preferablein view of excellent processability and heat resistance, and easyindustrial availability.

Manufacturing methods of the PPS may include the following ones:

-   (1) a method in which a halogen-substituted aromatic compound, for    example, p-dichlorobenzene, is polymerized in the presence of sulfur    and sodium carbonate;-   (2) a method in which the polymerization is performed in a polar    solvent in the presence of any one of sodium sulfide, sodium    hydrogensulfide and hydrogen sulfide, and sodium hydroxide, or in    the presence of hydrogen sulfide and sodium aminoalkanoate; and-   (3) condensation of sodium sulfide and p-dichlorobenzene, and    self-condensation of p-chlorothiophenol.

Above all, a method is suitable in which sodium sulfide andp-dichlorobenzene are reacted in an amide solvent such asN-methylpyrrolidone or dimethylacetamide, or a sulfone solvent such assulfolane. These manufacturing methods are publicly known. PPS can beobtained, for example, by methods described in U.S. Pat. No. 2,513,188,Japanese Patent Publication Nos. 44-27671, 45-3368 and 52-12240,Japanese Patent Laid-Open No. 61-225217, U.S. Pat. No. 3,274,165,Japanese Patent Publication No. 46-27255, Belgian Patent No. 29437, andJapanese Patent Laid-Open No. 5-222196, and methods of prior artsexemplified in these patent documents.

PPS polymerized by the method described above may be oxidativelycrosslinked by heat treatment in the presence of oxygen at a temperatureof not more than the melting point of PPS. This method can provide acrosslinked PPS whose polymer molecular weight and viscosity arereasonably raised. This crosslinked PPS can also be suitably used in thepresent invention.

A linear PPS and a crosslinked PPS may be concurrently used in anoptional proportion.

Here, the oligomer amount contained in PPS can be determined by thefollowing extraction with methylene chloride.

-   (1) 5 g of PPS powder is added to 80 ml of methylene chloride, and    subjected to Soxhlet extraction for 6 hours.-   (2) The solution after the Soxhlet extraction is transferred to a    weighing bottle.-   (3) The vessel used in the extraction is washed separately three    times using 60 ml of the total of methylene chloride and the washing    liquid is recovered in the weighing bottle.-   (4) The weighing bottle is heated at about 80° C. to evaporate and    remove methylene chloride in the weighing bottle, and the residue is    weighed.

The residue amount corresponds to an extraction amount with methylenechloride, that is, the amount of oligomer present in PPS.

The amount of —SX group of PPS(S represents a sulfur atom, and Xrepresents an alkaline metal or a hydrogen atom.) can be quantitativelydetermined by the following method.

-   (1) 20 g of PPS powder dried at 120° C. for 4 hours is added to 150    g of N-methyl-2-pyrrolidone to obtain a slurry. At this time, the    mixture is vigorously stirred and mixed at room temperature for 30    min so that the powder agglomerate disappears.-   (2) The slurry is filtered and washed seven times using 1 L of warm    water of about 80° C. in every time.-   (3) The filter cake obtained in (2) is mixed with 200 g of pure    water to again obtain a slurry. Then, 1N hydrochloric acid is added    to the slurry to adjust the pH of the slurry at 4.5.-   (4) The slurry is stirred at 25° C. for 30 min, and then filtered,    and washed six times using 1 L of warm water of about 80° C. in    every time.-   (5) The filter cake obtained in (4) is again mixed with 200 g of    pure water to obtain a slurry. Then, the slurry is subjected to    titration with 1N sodium hydroxide.

The amount of —SX group present in PPS can be determined by the consumedamount of sodium hydroxide.

As the liquid crystal polymer, publicly known polyesters calledthermotropic liquid crystal polymers can be used. Example of the liquidcrystal polymer may include thermotropic liquid crystal polyesterscomposed of p-hydroxybenzoic acid and a polyethylene terephthalate asmain constituting units, thermotropic liquid crystal polyesters composedof p-hydroxybenzoic acid and 2-hydroxy-naphthoic acid as mainconstituting units, and thermotropic liquid crystal polyesters composedof p-hydroxybenzoic acid, 4,4′-dihydroxybiphenyl and terephthalic acidas main constituting units, and are not especially limited.

The noncrystalline resins may preferably include styrene resins andpolyphenylene ethers.

The styrene resins may include atactic polystyrenes, rubber-reinforcedpolystyrenes (HIPS), styrene-acrylonitrile copolymers (AS) having astyrene content of not less than 50% by weight, and rubber-reinforced ASresins.

The polyphenylene ether (PPE) is composed of a bonding unit describedbelow.

(wherein O represents an oxygen atom; and R represents a group selectedfrom the group consisting of hydrogen, halogen, a primary or secondaryalkyl group having 1 to 7 carbon atoms, a phenyl group, a haloalkylgroup, an aminoalkyl group, a hydrocarbonoxy group, and ahalohydrocarbonoxy group in which at least two carbon atoms separate ahalogen atom and an oxygen atom, and may be the same or different in thesame bonding unit.)

The reduced viscosity of PPE (chloroform solution of 0.5 g/dl thereof,measured at 30° C.) is preferably in a range of from 0.15 to 2, morepreferably in the range of from 0.2 to 1. PPE may be a homopolymer, acopolymer or their mixture.

Specific examples of PPE may include polyphenylene ether copolymers suchas poly(2,6-dimethyl-1,4-phenylene ether),poly(2-methyl-6-ethyl-1,4-phenylene ether),poly(2-methyl-6-phenyl-1,4-phenylene ether) andpoly(2,6-dichloro-1,4-phenylene ether); and also copolymers of2,6-dimethylphenol and another phenol (for example,2,3,6-trimethylphenol and 2-methyl-6-butylphenol). Above all, apoly(2,6-dimethyl-1,4-phenylene ether), and a copolymer of2,6-dimethylphenol and 2,3,6-trimethylphenol are preferable, andespecially a poly(2,6-dimethyl-1,4-phenylene ether) is preferable.

Manufacturing methods of the PPE are not especially limited as long asthey are publicly known ones. PPE can be easily manufactured, forexample, by a method by Hay described in U.S. Pat. No. 3,306,874 inwhich 2,6-xylenol and the like are subjected to oxidative polymerizationusing as a catalyst a complex of a cuprous salt and an amine. Besides,PPE can be easily manufactured by methods described in U.S. Pat. Nos.3,306,875, 3,257,357 and 3,257,358, Japanese Patent Publication No.52-17880, Japanese Patent Laid-Open Nos. 50-51197 and 63-152628, and thelike.

In the case of combining two or more different kinds of resins as (a)thermoplastic resins, the combination may be a polymer alloy obtained bysubjecting them to heat melt mixing or solution mixing.

Preferable polymer alloys are those of PPE, and PPS, a styrene resin, apolyolefin, a polyamide, a polyester or a liquid crystal polymer, butare not limited thereto.

In the case of using a polymer alloy, an admixture may be formulated inaddition to different two or more kinds of resins. For example, in thecase of a polymer alloy of PPS/PPE, an epoxy resin, a silane couplingagent, a styrene-glycidyl methacrylate copolymer, a copolymer of styreneand 2-isopropenyl-2-oxazoline, a styrene-maleic anhydride copolymer anda polyisocyanate compound can be used as an admixture.

In the case of a polymer alloy of polyolefin/PPE, a hydrogenated blockcopolymer, and a block copolymer or a graft copolymer having apolyolefin chain-polystyrene chain can be used as an admixture.

In the case of a polymer alloy of polyamide/PPE, a styrene-maleicanhydride copolymer, a styrene-glycidyl methacrylate copolymer, acopolymer of styrene and 2-isopropenyl-2-oxazoline, and a maleicanhydride-grafted PPE can be used as an admixture.

In the case of a polymer alloy of polyester/PPE, a styrene-glycidylmethacrylate copolymer, a copolymer of styrene and2-isopropenyl-2-oxazoline, and a polyisocyanate compound can be used asan admixture.

The polyisocyanate compound as an admixture may include 2,4-toluylenediisocyanate, 2,6-toluylene diisocyanate, 4,4′-diphenylmethanediisocyanate, 3,3′-dimethylbiphenyl-4,4′-diisocyanate, isophoronediisocyanate, hexamethylene diisocyanate and polymethylene polyphenylenepolyisocyanates.

(b) Nonconductive fibrous inorganic filler refers to an inorganic fillerwhich is nonconductive and fibrous. (b) Nonconductive fibrous inorganicfiller has an average fiber diameter of not more than 15 μm. Publiclyknown inorganic filers satisfying the above condition can be used. Thediameter is not more than 15 μm for providing a stable surfaceresistance value and volume resistance value, both of which areequivalent to each other, of the antistatic region and the staticdissipative region. The diameter is preferably not less than 1 μm inview of its easy availability.

Specifically, the fillers include glass fibers (continuous glass fibersand chopped strand glass fibers), alumina fibers, ceramic fibers, gypsumfibers, potassium titanate whiskers, magnesium sulfate whiskers, zincoxide whiskers, calcium carbonate whiskers, calcium silicate whiskers,wallastonite and the like. Above all, glass fibers are preferable andglass fibers having an average fiber diameter of from 4 to 10 μm aremost preferable.

The fiber diameter is measured by the following method.

-   (1) A glass chopped strand and a resin composition are put in a    crucible, and burned in an electric furnace of 550° C. for 2 hours.-   (2) The resin component and the remaining inorganic filler are    separated; the glass fibers in the remaining inorganic filler are    photographed by a microscope; and the diameters of 100 glass fibers    are measured on the photograph.

In the present application, the average of the 100 glass fibers isdefined as an average fiber diameter.

Further, inorganic fillers may be used which have been subjected tosurface treatment with a silane-based coupling agent, a titanate-basedcoupling agent, an aliphatic metal salt or the like, which have beensubjected to organization treatment by the intercalation method usingammonium salt or the like, or in which a resin such as a urethane resinor an epoxy resin is used as a binder.

Graphite of the (c) component of the present invention has an averageparticle diameter of from 1 to 50 μm. (c) Graphite is either of anartificial graphite and a natural graphite having a fixed carbon of notless than 90%. Preferable shapes are scaly and flaky. The averageparticle diameter can be measured by the screening analysis or a laserdiffraction type particle size distribution measuring apparatusaccording to “Methods for industrial analysis and testing of naturalgraphite” of JIS M8511. In the present invention, a laser diffractiontype particle size distribution measuring apparatus was used.

The diameter is not more than 50 μm for providing a stable surfaceresistance value and volume resistance value, both of which areequivalent to each other, of the antistatic region and the staticdissipative region. The diameter is preferably not less than 1 μm inview of its conductivity.

Graphite of the (c) component having an average particle diameter offrom 1 to 50 μm can be obtained by crushing the natural graphite or theartificial graphite by a mechanical crushing method using a crusher, forexample, a grain mill, a Victory mill, a stamp mill, a ball mill, a jetmill or a high-speed rotation mill. The graphite obtained by the methodmay be subjected to surface treatment of the graphite surface with asilane-based coupling agent, a titanate-based coupling agent, a metalsalt of an aliphatic compound or the like, or may be subjected toorganization treatment by the intercalation method using an ammoniumsalt or the like, or may use a resin such as a urethane resin or anepoxy resin as a binder, for further enhancing an effect on itsdispersion in a resin.

In the present invention, two kinds of (c) graphite are used which havedifferent average particle diameters, and have a difference in averageparticle diameter of not less than 5 μm. As long as two kinds of (c)graphite are contained which have different average particle diameters,and have a difference in average particle diameter of not less than 5μm, two or more kinds thereof may be used.

In the case of using two kinds of (c) graphite having different averageparticle diameters, graphite having a larger average particle diameteris defined as (c1) graphite; and graphite having a smaller one isdefined as (c2) graphite. The difference in average particle diameterbetween the (c1) graphite and the (c2) graphite is not less than 5 μm.

Concurrent use of (c) graphite concurrently containing (c1) graphite and(c2) graphite, and (b) nonconductive fibrous inorganic filler describedabove having an average particle diameter of not more than 15 μm,results in a stable surface resistance value and volume resistancevalue, both of which are equivalent to each other, of the antistaticregion and the static dissipative region. Further, remolded productsobtained reutilizing molded products exhibit also a similarnoninsulating property.

A more preferable mode when (c1) graphite and (c2) graphite areconcurrently used is as follows.

-   (1) The (c1) graphite has an average particle diameter of from 15 to    50 μm; and the (c2) graphite has that of from 1 to 10 μm.-   (2) The ratio of the average particle diameters ((the average    particle diameter of the (c1) graphite)/(the average particle    diameter of the (c2) graphite)) is from 3 to 10.-   (3) The weight ratio of the formulation amounts ((the formulation    amount of the (c1) graphite)/(the formulation amount of the (c2)    graphite)) is from 0.1 to 1.

The formulation amounts of the components of the resin compositionaccording to the present invention include 100 parts by weight of (a)component; 20 to 80 parts by weight of (b) component; and 10 to 70 partsby weight of (c) component. The formulation amount of the (c) componentis the total of two kinds of the (c) graphite having different averageparticle diameters and a difference in average particle diameter of notless than 5 μm. This formulation can provide a stable antistatic resincomposition and static dissipative resin composition exhibiting littlevariation in surface resistivity and having the equivalence of anactually measured surface resistance value and volume resistance value.The molded product thereof also has little variation in surfaceresistivity and a stable actually measured surface resistance value andvolume resistance value, both of which are equivalent to each other.Further, remolded products obtained by reutilizing the molded productsexhibit also a similar noninsulating property. Further, the impactresistance and the mechanical properties are excellent. Formulation ofnot less than 20 parts by weight of (b) component and not less than 10parts by weight of (c) component exhibits an effect of the concurrentuse of the (b) component and the (c) component. Specifically, thesurface resistance value and the volume resistance value of the obtainedantistatic resin composition and static dissipative resin compositionare stable, and are equivalent to each other. On the other hand,formulation of not more than 80 parts by weight of the (b) component andnot more than 70 parts by weight of the (c) component can provide aresin composition for making molded products which are reutilized forobtaining remolded products exhibiting a similar noninsulating property.

The resistance value and the resistivity in the present invention weremeasured by the double ring probe method according to JIS K6911.

The resistance measuring apparatus used in the present invention has adisk-like main electrode having a diameter of 19.6 mm and a ring-shapedelectrode having an inner diameter of 24.1 mm and an outer diameter of28.8 mm concentrically outside the main electrode. The measurement ofsurface resistance is conducted by placing a molded product over boththe disk-like main electrode and the ring-shaped guard electrode andmeasuring a resistance value of the molded product generated on thesurface contacting with both the electrodes. The surface resistivity isa value of a product of the surface resistance value thus obtained andan electrode constant.

A preferable surface resistivity of the resin composition is from 1×10⁵to 1×10¹⁴ Ω/sq.

The measurement of the volume resistance is conducted by measuring aresistance value of the molded product generated between the disk-likemain electrode and a metal surface (counter electrode) contacting withthe surface of the opposite side of the contact surface with the mainelectrode of the molded product. The volume resistivity is a valueobtained by dividing a product of the volume resistance value thusobtained and an electrode constant by the thickness of the moldedproduct.

Whether the surface resistance value and the volume resistance value areequivalent to each other is judged by a value obtained by dividing asurface resistance value (Rs) by a volume resistance value (Rv). Thisvalue is defined as an anisotropy (A).A=Rs/Rv

The case of A=1 means “the surface resistance value=the volumeresistance value” and no anisotropy between both the resistance values.

The anisotropy (A) of the resin composition is preferably from 0.3 to1.5 practically. It is more preferably from 0.4 to 1.4, still morepreferably from 0.4 to 1.2. For making the anisotropy (A) of theresistance values in these ranges, a composition obtained by combiningthe (b) component and the (c) component described above must be made.

The stability (S) of the resin composition is judged by the calculatingexpression described below.S=(log Rsmax)−(log Rsmin)(Rsmax: a maximum value of surface resistance values measured at aplurality of points; and Rsmin: a minimum value of the surfaceresistance values measured at the plurality of points)

The S described above of about not more than 3 is preferable in view ofthe stability of the resistance value.

In the present invention, in addition to the components described above,another thermoplastic elastomer (a hydrogenated block copolymer andpolyolefin elastomer), a stabilizer such as a thermal stabilizer, anantioxidant or an ultraviolet absorbent, a crystal nucleating agent, aflame retardant, and a publicly known releasing agent such as alubricant oil, a polyethylene wax, a polypropylene wax, a montanic saltwax or a stearic salt wax, can be suitably added as needed in the rangewhere the feature and the effect of the present invention are notdamaged.

The resin composition according to the present invention can bemanufactured by melting and kneading the components described above byusing a heat-melting and kneading machine such as a single screwextruder, a twin screw extruder, a roll, a kneader, a BrabenderPlastograph or a Banbury mixer. Above all, the manufacturing method ofmelting and kneading by using a twin screw extruder is preferable.

The melting and kneading temperature is preferably selected such that acrystalline resin is heat-melted and can unforcibly be processed at atemperature of not less than its melting temperature; and anoncrystalline resin is at a temperature of not less than its glasstransition temperature. The temperature is commonly in the range of from200 to 370° C.

The screw rotation frequency is preferably from 100 to 1,200 rpm, morepreferably from 200 to 500 rpm.

A specific manufacturing method of the resin composition according tothe present invention by a twin screw extruder is preferably a methoddescribed below.

-   (1) A thermoplastic resin of (a) component is supplied to a first    supply port of a twin screw extruder, and melted and kneaded with    the temperature of a heat melt zone set at the melting temperature    thereof.-   (2) In a state that the (a) component is being melted and kneaded, a    nonconductive fibrous inorganic filler of (b) component and a    graphite of (c) component are supplied to a second supply port of    the extruder, and the mixture is further melted and kneaded.

With respect to the positions where the (b) component and the (c)component are supplied, they may be collectively supplied to the secondsupply port of the extruder as described above, or the (b) component andthe (c) component may be separately supplied to the second supply portand an installed third supply port.

An antistatic resin composition and a static dissipative resincomposition are thus obtained. The compositions have the stable surfaceresistance value and volume resistance value, both of which areequivalent to each other. Further, remolded products obtainedreutilizing molded products thereof have a similar noninsulatingproperty. The molding methods may include, for example, injectionmolding, metal-in molding, outsert molding, hollow molding, extrusionmolding, sheet molding, heat press molding, rotation molding andlamination molding.

EXAMPLES

Hereinafter, the present invention will be described by way of Examples.

1. Raw Materials

Raw materials used were as follows.

(1) Polyphenylene Sulfide

-   PPS-1: a linear PPS

Melt viscosity: 50 Pa·s

Oligomer amount: 0.4% by weight

—SX group amount: 29 μmol/g

-   PPS-2: a crosslinked PPS

Melt viscosity: 60 Pa·s

Extraction amount with methylene chloride: 0.7% by weight

(2) Polyphenylene Ether

-   PPE-1: PPE having a reduced viscosity of 0.53 dl/g-   PPE-2: PPE having a reduced viscosity of 0.52 dl/g-   PPE-3: PPE having a reduced viscosity of 0.31 dl/g-   PPE-4: PPE having a reduced viscosity of 0.42 dl/g    (3) High-impact Polystyrene-   HIPS: H0103, made by Japan Polystyrene Inc.    (4) Polypropylene-   PP: melting point of 167° C., MFR=4.6 (g/10 min)    (5) Polyamide-   PA: Nylon 66

Number-average molecular weight: 14,000

Terminal amino group concentration: 30 milliequivalent/kg

Terminal carboxyl group concentration: 100 milliequivalent/kg

(6) Polybutylene Terephthalate PBT: Duranex 2002 (Trade Name), Made byWinTech Polymer Ltd.

(7) Liquid Crystal Polymer

-   LCP: a liquid crystal polymer obtained by heating, melting and    polycondensating p-hydroxybenzoic acid, 2-hydroxy-6-naphthoic acid    and acetic anhydride under a nitrogen atmosphere.    (8) Hydrogenated Block Copolymer-   HB-1: a hydrogenated block copolymer made by Krayton Polymers    (product name: Krayton G-1651)

Structure: polystyrene-hydrogenated polybutadiene-polystyrene

-   HB-2:

Structure: polystyrene-hydrogenated polybutadiene-polystyrene

Bonded styrene amount: 45%

Number-average molecular weight: 86,000

Molecular weight distribution: 1.07

Bonded 1,2-vinyl amount of the polybutadiene before hydrogenation: 75%

-   HB-3:

Structure: polystyrene-hydrogenated polybutadiene-polystyrene

Number-average molecular weight: 176,000

Bonded styrene amount: 33% by weight

(9) Others

-   OT-1: a styrene-glycidyl methacrylate copolymer

Containing 5% by weight of glycidyl methacrylate

Weight-average molecular weight: 110,000

-   OT-2: an atactic homopolystyrene (685, made by Japan Polystyrene    Inc.)-   OT-3: a flame retardant (triphenyl phosphate, made by Daihachi    Chemical Industry Co., Ltd., (product name: TPP))-   OT-4: a styrene-2-propenyl-2-oxazoline copolymer

Containing 5% by weight of 2-propenyl-2-oxazoline

Weight-average molecular weight: 146,000

-   OT-5: maleic anhydride    Thermoplastic Resins of (a) Component

Thermoplastic resins of (a) component were manufactured using the rawmaterials described above. The detailed formulations are shown in Table1.

-   a-1: PPS-1-   a-2: PPS-2, PPE-1 and OT-1 were melted and kneaded in the    formulation shown in Table 1 under the condition below to    manufacture a PPS/PPE polymer alloy.

Extruder a twin screw extruder with vent ports (ZSK-40, made by CoperionWerner & Pfleiderer, Germany)

Set temperature: 300° C.

Screw rotation frequency: 300 rpm

All of PPS-2, PPE-1 and OT-1 were supplied to a first supply port, andmelted and kneaded. The extruder was degassed under a reduced pressurefrom a first vent port, and further degassed under a reduced pressurealso from a second vent port installed at a place near the outlet portof the extruder. A polymer alloy (a-2) was obtained as pellets.

-   a-3: a PPS/PPE polymer alloy was manufactured in the formulation    shown in Table 1 as in a-2.-   a-4: a PPS/PPE polymer alloy was manufactured in the formulation    shown in Table 1 as in a-2.-   a-5: a PPS/PPE polymer alloy was manufactured in the formulation    shown in Table 1 as in a-2.-   a-6: HIPS, PPE-2, HB-1 and OT-3 were melted and kneaded in the    formulation shown in Table 1 under the condition below to    manufacture a PPE/HIPS polymer alloy.

Extruder a twin screw extruder with vent ports (ZSK-40, made by CoperionWerner & Pfleiderer, Germany)

Set temperature: 270 to 290° C.

Screw rotation frequency: 250 rpm

A part of HIPS (8.8 parts by weight), PPE-2, HB-1 and OT-3 were suppliedto a first supply port, and melted and kneaded. The extruder wasdegassed under a reduced pressure from a first vent port. The remainderof the HIPS (39 parts by weight) was supplied to a second supply port,and melted and kneaded. The extruder was degassed under a reducedpressure also from a second vent port. A polymer alloy (a-6) wasobtained as pellets.

-   a-7: PP, PPE-3 and HB-2 were melted and kneaded in the formulation    shown in Table 1 under the condition below to manufacture a PP/PPE    polymer alloy.

Extruder a twin screw extruder with vent ports (ZSK-40, made by CoperionWerner & Pfleiderer, Germany)

Set temperature: 300° C.

Screw rotation frequency: 300 rpm

A part of PP (9.1 parts by weight), PPE-3 and HB-2 were supplied to afirst supply port, and melted and kneaded. The extruder was degassedunder a reduced pressure from a first vent port. The remainder of the PP(45.4 parts by weight) was supplied to a second supply port, and meltedand kneaded. The extruder was degassed under a reduced pressure alsofrom a second vent port. A polymer alloy (a-7) was obtained as pellets.The morphology of the polymer alloy had the polypropylene as a matrixand PPE particles dispersed. The dispersed PPE particle was covered withthe hydrogenated block copolymer as the outer shell.

-   a-8: PA, PPE-3, HB-3 and OT-5 were melted and kneaded in the    formulation shown in Table 1 under the condition below to    manufacture a PA/PPE polymer alloy.

Extruder a twin screw extruder with vent ports (ZSK-40, made by CoperionWerner & Pfleiderer, Germany)

Set temperature: 300° C.

Screw rotation frequency: 300 rpm

PPE-3, HB-3 and OT-5 were supplied to a first supply port, and meltedand kneaded. The extruder was degassed under a reduced pressure from afirst vent port. PA was supplied to a second supply port, and melted andkneaded. The extruder was degassed under a reduced pressure also from asecond vent port. A polymer alloy (a-8) was obtained as pellets. Themorphology of the polymer alloy had the polyamide as a matrix and PPEparticles dispersed. The hydrogenated block copolymer was dispersed inthe dispersed PPE particle.

-   a-9: PE, PPE-3, HB-3 and OT-1 were melted and kneaded in the    formulation shown in Table 1 under the condition below to    manufacture a PBT/PPE polymer alloy.

Extruder a twin screw extruder with vent ports (ZSK-40, made by CoperionWerner & Pfleiderer, Germany)

Set temperature: 300° C.

Screw rotation frequency: 300 rpm

PE, PPE-3, HB-3 and OT-1 were supplied to a first supply port, andmelted and kneaded. The extruder was degassed under a reduced pressurefrom a first vent port. The extruder was degassed under a reducedpressure also from a second vent port. A polymer alloy (a-9) wasobtained as pellets. The morphology of the polymer alloy had thepolybutylene terephthalate as a matrix and PPE particles dispersed. Thehydrogenated block copolymer was dispersed in the dispersed PPEparticle.

-   a-10: LCP-   a-11: LCP and PPE-4 were melted and kneaded in the formulation shown    in Table 1 under the condition below to manufacture an LCP/PPE    polymer alloy.

Extruder a twin screw extruder with vent ports (ZSK-40, made by CoperionWerner & Pfleiderer, Germany)

Set temperature: 310° C.

Screw rotation frequency: 300 rpm

LCP and PPE-4 were supplied to a first supply port, and melted andkneaded. The extruder was degassed under a reduced pressure from a firstvent port. The extruder was degassed under a reduced pressure also froma second vent port. A polymer alloy (a-11) was obtained as pellets. Themorphology of the polymer alloy had the LCP as a matrix and PPEparticles dispersed.

The measuring conditions of the physical properties described above willbe described below.

(i) Measuring Condition of Melt Viscosity

-   Measuring apparatus: a flow tester

L/D (L: die length/D: die diameter)=10/1

Measuring temperature: 300° C.

Load: 196 N

The measurement was conducted after a sample was kept under thecondition above for 6 min.

(ii) Measuring Condition of Reduced Viscosity

Measuring solution: a chloroform solution in which a resin concentrationwas adjusted at 0.5 g/dl

Measuring temperature: 30° C.

Nonconductive Fibrous Inorganic Fillers of (b) Component

-   b-1: a glass fiber having an average fiber diameter of 13 μm and a    cut length of 3 mm and surface-treated with an aminosilane-based    coupling agent-   b-2: a glass fiber having an average fiber diameter of 6.5 μm and a    cut length of 3 mm and surface-treated with an aminosilane-based    coupling agent-   b-3: a glass fiber having an average fiber diameter of 6.5 μm and a    cut length of 3 mm and surface-treated with an epoxysilane-based    coupling agent-   b-4: a glass fiber having an average fiber diameter of 17 μm and    surface-treated with an aminosilane-based coupling agent

Binders for the (b-1) to (b-4) glass fibers were all epoxy resins.

Graphites of (c) Component

-   c-1: a flaky graphite having an average particle diameter of 2 μm-   c-2: a flaky graphite having an average particle diameter of 5 μm-   c-3: a flaky graphite having an average particle diameter of 10 μm-   c-4: a flaky graphite having an average particle diameter of 20 μm-   c-5: a flaky graphite having an average particle diameter of 30 μm-   c-6: a flaky graphite having an average particle diameter of 50 μm-   c-7: a flaky graphite having an average particle diameter of 60 μm-   c-8: a flaky graphite having an average particle diameter of 130 μm-   c-9: a flaky graphite having an average particle diameter of 20 μm    and surface-treated with an aminosilane-based coupling agent    (d) Other Components-   d-1: a carbon fiber having an average fiber diameter of 6 μm and    surface-treated with an epoxysilane-based coupling agent-   d-2: a particulate graphite having an average particle diameter of    20 μm-   d-3: acetylene black having an average particle diameter of 18 nm-   d-4: conductive carbon black (Ketjen Black EC600JD, made by Ketjen    Black International Co., Ltd.)    2. Evaluating Methods of Molded Products

Molded products molded by using resin compositions obtained from the (a)to (d) components were evaluated as follows.

(1) Surface Resistance Value and Surface Resistivity

The surface resistance value and the surface resistivity were measuredusing the double ring probe method according to JIS-K6900.

Measuring apparatus: an apparatus in which the two below were connected

Super-insulation tester (SM8213, made by DKK-TOA Corp.)

Electrode for flat plate SME8311, made by DKK-TOA Corp.

-   -   The diameter of the main electrode: 19.6 mm    -   The inner diameter of the ring-shaped electrode: 24.1 mm, the        outer diameter thereof: 28.8 mm

Samples having an electric resistance of less than 2.5×10⁴Ω weremeasured using a digital ultrahigh resistance meter (R8340A, made byAdvantest Corp.) in place of the super-insulation tester.

-   Samples: 5 plates of a platy injection molded product of 75 mm    width, 75 mm wide and 3 mm thickness

The plates were allowed to stand at 23° C. and a relative humidity of50% for not less than 24 hours

Measuring condition: voltage: 100 V, measuring time: 10 sec

The surface resistance value (Rs) was measured between the mainelectrode and the ring-shaped electrode. 5 plate samples were used, andeach sample was measured at 4 points. The average of 20 points of thetotal was made as a measurement value.

A value obtained by multiplying the surface resistance value (Rs) by 30of an electrode constant of the used electrode was made as the surfaceresistivity (Ω/sq.).

(2) Volume Resistance Value and Volume Resistivity

The volume resistance value and the volume resistivity were measuredusing the double ring probe method according to JIS-K6900.

Measuring apparatus: an apparatus in which the two below were connected

Super-insulation tester (SM8213, made by DKK-TOA Corp.)

Electrode for flat plate SME8311, made by DKK-TOA Corp.

-   -   The diameter of the main electrode: 19.6 mm    -   The inner diameter of the ring-shaped electrode: 24.1 mm, the        outer diameter thereof 28.8 mm

Samples having an electric resistance of less than 2.5×10⁴Ω weremeasured using a digital ultrahigh resistance meter (R8340A, made byAdvantest Corp.).

-   Samples: 5 plates of a platy injection molded product of 75 mm    length, 75 mm width and 3 mm thickness

The plates were allowed to stand at 23° C. and a relative humidity of50% for not less than 24 hours

Measuring condition: voltage: 100 V, measuring time: 10 sec

The ring-shaped electrode was used as a guard electrode.

The volume resistance value (Rv) in the thickness direction was measuredbetween the main electrode and the metal of the counter electrodecontacting with the surface of the opposite side of the molded productcontacting with the main electrode. The average of 5 plate samples wasmade as a measurement value.

A value obtained by dividing a product of the volume resistance value(Rv) and 30 of an electrode constant of the used electrode by thethickness (mm) of the molded product was made as a volume resistivity(Ω·cm).

(3) Anisotropy (A) of Resistance Value

The anisotropy (A) of resistance value was determined by the followingcalculation expression.(A)=(Rs)/(Rv)(Rs: a surface resistance value measured by the measuring methoddescribed above, and Rv: a volume resistance value measured by themeasuring method described above)(4) Stability (S) of Resistance Value

The stability of resistance value was determined by the followingexpression.(S)=(log Rsmax)−(log Rsmin)

-   (Rsmax: a maximum value of surface resistance values for 20 points    measured in (1), and Rsmin: a minimum value of the surface    resistance values for the 20 points measured in (1))    (5) Performance of Remolded Products Obtained by Reutilizing Molded    Products

Flat plates for measurement of resistance value were againinjection-molded by using reutilized pellets in 100%. The surfaceresistance value (Rs) and the volume resistance value (Rv) of theinjection remolded products were measured by the methods described in(1) to (4) above; and the surface resistivity (Ω/sq.), the volumeresistivity (Ω·cm), the anisotropy (A) of the resistance value and thestability (S) of the resistance value were determined.

3. Examples 1 to 24 Comparative Examples 1 to 13

(i) Manufacturing Method of Resin Compositions

Formulations: the (a) to (c) components, formulation amounts shown inTable 2 and Table 3

Extruder a twin screw extruder with vent ports (ZSK-40, made by CoperionWerner & Pfleiderer, Germany)

Set temperature: 250 to 310° C.

Screw rotation frequency: 300 rpm

The thermoplastic resin as the (a) component was supplied to a firstsupply port while the (b) to (c) components were supplied to a secondsupply port; and the mixture was melted and kneaded to obtain acorresponding resin composition as pellets.

(ii) Injection Molding Method

Molding machine: a screw in-line type injection molding machine

Set temperature: 250 to 310° C.

Metal mold temperature: at PPS molding: 130° C.

-   -   at PA/PPE polymer alloy molding: 80° C.    -   at PP/PPE polymer alloy molding: 60° C.    -   at PPE resin composition molding: 80° C.

Samples: pellets described above

(iii) Manufacturing Method of Reutilized Pellets

-   Raw materials: resins obtained by crushing the spool sections and    runner sections generated in molding platy molded products described    above-   Extruder a single screw extruder with a vent port (SRV-L40, made by    Nihon Yuki Co., Ltd.)

Set temperature: 250 to 310° C.

Screw rotation frequency: 80 rpm

Pelletization was performed under the condition described above toobtain reutilized pellets.

(iv) Injection Molding Method of Remolded Products

Raw materials: obtained reutilized pellets

The molding condition was the same as in (ii) described above.

The evaluation results of the obtained injection molded products aretogether shown in Tables 2 and 3.

TABLE 1 Resin Resin Resin Other Outline of components composition 1composition 2 composition 3 composition Remarks Formu- a-1 PPS PPS-1PPS-1 alone was used lation a-2 PPS/PPE alloy PPS-2/68.6 PPE-1/29.4OT-1/2 (parts a-3 PPS/PPE alloy PPS-1/68.6 PPE-1/29.4 OT-1/2 by a-4PPS/PPE alloy PPS-2/70 PPE-1/20 OT-2/10 weight) a-5 PPS/PPE alloyPPS-2/68.6 PPE-1/29.4 OT-4/2 a-6 PPE/HIPS alloy HIPS/47.8 PPE-2/39.2HB-1/4.3 OT-3/8.7 a-7 PP/PPE alloy PP/54.5 PPE-3/36.4 HB-2/9.1 a-8PA66/PPE alloy PA/54.3 PPE-3/36.2 HB-3/9.0 OT-5/0.5 a-9 PBT/PPE alloyPE/53.3 PPE-3/35.6 HB-3/8.9 OT-1/2.2 a-10 LCP LCP LCP alone was useda-11 LCP/PPE alloy LCP/60 PPE-4/40

TABLE 2 Outline of components Ex. 1 Ex. 2 Ex. 3 Ex. 4 Ex. 5 Ex. 6 Ex. 7Ex. 8 Formu- a-1 PPS 100 50 lation a-2 PPS/PPE alloy 100 100 50 100compo- a-3 PPS/PPE alloy 100 nents a-4 PPS/PPE alloy 100 (parts a-5PPS/PPE alloy 100 by a-6 PPE/HIPS alloy weight) a-7 PP/PPE alloy a-8PA66/PPE alloy a-9 PBT/PPE alloy a-10 LCP a-11 LCP/PPE alloy b-1 GF of13 μm b-2 GF of 6.5 μm 65 b-3 GF of 6.5 μm 35 35 35 35 35 35 35 b-4 GFof 17 μm c-1 Graphite of 2 μm c-2 Graphite of 5 μm 25 17 25 25 25 25 2525 c-3 Graphite of 10 μm c-4 Graphite of 20 μm 14 c-5 Graphite of 30 μm10 10 10 10 10 10 c-6 Graphite of 50 μm 5 c-7 Graphite of 60 μm c-8Graphite of 130 μm c-9 Graphite of 20 μm d-1 Carbon fiber of 6 μm d-2Particulate graphite of 20 μm d-3 Acetylene black d-4 Ketjen blackPerfor- Surface resistance value (Rs): Ω 2.0 × 10⁵ 2.5 × 10⁵ 3.8 × 10⁵3.5 × 10⁵ 3.1 × 10⁵ 2.6 × 10⁵ 2.8 × 10⁵ 8.1 × 10⁵ mance Surfaceresistivity: Ω/sq. 6.0 × 10⁶ 7.5 × 10⁶ 1.1 × 10⁷ 1.1 × 10⁷ 9.3 × 10⁶ 7.8× 10⁶ 8.4 × 10⁶ 2.4 × 10⁷ Volume resistance value (Rv): Ω 2.3 × 10⁵ 4.3× 10⁵ 4.2 × 10⁵ 3.6 × 10⁵ 3.1 × 10⁵ 2.8 × 10⁵ 3.0 × 10⁵ 7.8 × 10⁵ Volumeresistivity: Ω · cm 2.3 × 10⁶ 4.3 × 10⁶ 4.2 × 10⁶ 3.6 × 10⁶ 3.1 × 10⁶2.8 × 10⁶ 3.0 × 10⁶ 7.8 × 10⁶ Anisotropy (A) of resistance value 0.870.58 0.90 0.97 1.00 0.93 0.93 1.04 Stability (S) of resistance value 1.21.5 1.3 1.6 1.7 2.2 1.8 1.5 Perfor- Surface resistance value (Rs): Ω 3.1× 10⁵ 2.8 × 10⁵ 4.4 × 10⁵ 4.0 × 10⁵ 3.8 × 10⁵ 3.1 × 10⁵ 3.3 × 10⁵ 9.0 ×10⁵ mance Surface resistivity: Ω/sq. 9.3 × 10⁶ 8.4 × 10⁶ 1.3 × 10⁷ 1.2 ×10⁷ 1.1 × 10⁷ 9.3 × 10⁶ 9.9 × 10⁶ 2.7 × 10⁷ of re- Volume resistancevalue (Rv): Ω 2.8 × 10⁵ 4.4 × 10⁵ 4.5 × 10⁵ 4.1 × 10⁵ 3.4 × 10⁵ 2.8 ×10⁵ 2.8 × 10⁵ 9.4 × 10⁵ molded Volume resistivity: Ω · cm 2.8 × 10⁶ 4.4× 10⁶ 4.5 × 10⁶ 4.1 × 10⁶ 3.4 × 10⁶ 2.8 × 10⁶ 2.8 × 10⁶ 9.4 × 10⁶product Anisotropy (A) of resistance value 1.11 0.64 0.98 0.98 1.12 1.111.18 0.96 Stability (S) of resistance value 1.4 1.6 1.5 1.8 2.0 2.4 2.21.8 Outline of components Ex. 9 Ex. 10 Ex. 11 Ex. 12 Ex. 13 Ex. 14 Ex.15 Ex. 16 Formu- a-1 PPS lation a-2 PPS/PPE alloy 100 100 100 100 100100 100 100 compo- a-3 PPS/PPE alloy nents a-4 PPS/PPE alloy (parts a-5PPS/PPE alloy by a-6 PPE/HIPS alloy weight) a-7 PP/PPE alloy a-8PA66/PPE alloy a-9 PBT/PPE alloy a-10 LCP a-11 LCP/PPE alloy b-1 GF of13 μm b-2 GF of 6.5 μm b-3 GF of 6.5 μm 35 35 65 15 35 35 35 35 b-4 GFof 17 μm c-1 Graphite of 2 μm 30 50 c-2 Graphite of 5 μm 13 25 10 25 c-3Graphite of 10 μm 15 15 10 c-4 Graphite of 20 μm 15 15 5 c-5 Graphite of30 μm 5 10 5 c-6 Graphite of 50 μm c-7 Graphite of 60 μm c-8 Graphite of130 μm c-9 Graphite of 20 μm d-1 Carbon fiber of 6 μm d-2 Particulategraphite 15 of 20 μm d-3 Acetylene black d-4 Ketjen black Perfor-Surface resistance value (Rs): Ω 3.1 × 10⁶ 4.6 × 10⁵ 6.6 × 10⁷ 8.1 × 10⁸6.9 × 10¹⁰ 7.6 × 10⁸ 5.3 × 10⁸ 8.8 × 10⁸ mance Surface resistivity:Ω/sq. 9.3 × 10⁷ 1.4 × 10⁷ 2.0 × 10⁹  2.4 × 10¹⁰ 2.1 × 10¹²  2.3 × 10¹⁰ 1.6 × 10¹⁰  2.6 × 10¹⁰ Volume resistance value (Rv): Ω 3.0 × 10⁶ 3.9 ×10⁵ 6.7 × 10⁷ 7.6 × 10⁸ 6.0 × 10¹⁰ 7.6 × 10⁸ 4.4 × 10⁸ 5.7 × 10⁸ Volumeresistivity: Ω · cm 3.0 × 10⁷ 3.9 × 10⁶ 6.7 × 10⁸ 7.6 × 10⁹ 6.0 × 10¹¹7.6 × 10⁹ 4.4 × 10⁹ 5.7 × 10⁹ Anisotropy (A) of resistance value 1.031.18 0.99 1.07 1.15 1.00 1.20 1.54 Stability (S) of resistance value 2.60.8 1.1 2.4 1.7 1.6 1.6 1.9 Perfor- Surface resistance value (Rs): Ω 3.9× 10⁶ 5.1 × 10⁵ 7.1 × 10⁷ 8.7 × 10⁸ 7.4 × 10¹⁰ 7.8 × 10⁸ 5.5 × 10⁸ 1.0 ×10⁹ mance Surface resistivity: Ω/sq. 1.2 × 10⁸ 1.5 × 10⁷ 2.1 × 10⁹  2.6× 10¹⁰ 2.2 × 10¹²  2.3 × 10¹⁰  1.7 × 10¹⁰  3.0 × 10¹⁰ of re- Volumeresistance value (Rv): Ω 4.1 × 10⁶ 4.8 × 10⁵ 6.9 × 10⁷ 8.5 × 10⁸ 7.8 ×10¹⁰ 8.0 × 10⁸ 5.8 × 10⁸ 6.2 × 10⁸ molded Volume resistivity: Ω · cm 4.1× 10⁷ 4.8 × 10⁶ 6.9 × 10⁸ 8.5 × 10⁹ 7.8 × 10¹¹ 8.0 × 10⁹ 5.8 × 10⁹ 6.2 ×10⁹ product Anisotropy (A) of resistance value 0.95 1.06 1.03 0.98 0.950.98 0.95 1.61 Stability (S) of resistance value 3.1 1.1 1.3 2.8 2.6 2.12.4 2.7 Outline of components Ex. 17 Ex. 18 Ex. 19 Ex. 20 Ex. 21 Ex. 22Ex. 23 Ex. 24 Formu- a-1 PPS lation a-2 PPS/PPE alloy 100 100 compo- a-3PPS/PPE alloy nents a-4 PPS/PPE alloy (parts a-5 PPS/PPE alloy by a-6PPE/HIPS alloy 100 weight) a-7 PP/PPE alloy 100 a-8 PA66/PPE alloy 100a-9 PBT/PPE alloy 100 a-10 LCP 100 a-11 LCP/PPE alloy 100 b-1 GF of 13μm 25 20 b-2 GF of 6.5 μm b-3 GF of 6.5 μm 35 35 30 55 65 65 b-4 GF of17 μm c-1 Graphite of 2 μm 25 30 c-2 Graphite of 5 μm 22 15 20 20 c-3Graphite of 10 μm 10 15 c-4 Graphite of 20 μm 10 14 8 c-5 Graphite of 30μm 25 c-6 Graphite of 50 μm 10 8 c-7 Graphite of 60 μm c-8 Graphite of130 μm c-9 Graphite of 20 μm 5 13 d-1 Carbon fiber of 6 μm d-2Particulate graphite of 20 μm d-3 Acetylene black d-4 Ketjen blackPerfor- Surface resistance value (Rs): Ω 8.7 × 10⁷ 5.5 × 10⁴ 7.1 × 10⁶1.4 × 10⁷ 1.3 × 10⁵ 3.6 × 10⁹ 1.1 × 10⁵ 1.2 × 10⁵ mance Surfaceresistivity: Ω/sq. 2.6 × 10⁹ 1.7 × 10⁶ 2.1 × 10⁸ 4.2 × 10⁸ 3.9 × 10⁶ 1.1 × 10¹¹ 3.3 × 10⁶ 3.6 × 10⁶ Volume resistance value (Rv): Ω 4.8 ×10⁷ 2.9 × 10⁴ 1.6 × 10⁷ 2.3 × 10⁷ 1.7 × 10⁵ 5.7 × 10⁹ 1.4 × 10⁵ 1.6 ×10⁵ Volume resistivity: Ω · cm 4.8 × 10⁸ 2.9 × 10⁵ 1.6 × 10⁸ 2.3 × 10⁸1.7 × 10⁶  5.7 × 10¹⁰ 1.4 × 10⁶ 1.6 × 10⁶ Anisotropy (A) of resistancevalue 1.81 1.90 0.44 0.61 0.76 0.63 0.79 0.75 Stability (S) ofresistance value 1.7 1.0 1.4 1.3 1.7 1.4 0.9 0.7 Perfor- Surfaceresistance value (Rs): Ω 1.3 × 10⁸ 9.2 × 10⁴ 7.8 × 10⁶ 1.8 × 10⁷ 1.1 ×10⁵ 4.8 × 10⁹ 1.8 × 10⁵ 2.9 × 10⁵ mance Surface resistivity: Ω/sq. 3.9 ×10⁹ 2.8 × 10⁶ 2.3 × 10⁸ 5.4 × 10⁸ 3.3 × 10⁶  1.4 × 10¹¹ 5.4 × 10⁶ 8.7 ×10⁶ of re- Volume resistance value (Rv): Ω 6.9 × 10⁷ 4.7 × 10⁴ 1.5 × 10⁷2.9 × 10⁷ 1.4 × 10⁵ 5.1 × 10⁹ 2.1 × 10⁵ 3.7 × 10⁵ molded Volumeresistivity: Ω · cm 6.9 × 10⁸ 4.7 × 10⁵ 1.5 × 10⁸ 2.9 × 10⁸ 1.4 × 10⁵ 5.1 × 10¹⁰ 2.1 × 10⁶ 3.7 × 10⁶ product Anisotropy (A) of resistancevalue 1.88 1.96 0.52 0:62 0.79 0.94 0.86 0.78 Stability (S) ofresistance value 2.6 1.3 1.9 2.0 2.7 1.8 1.5 1.0

TABLE 3 Comp. Comp. Comp. Comp. Comp. Comp. Comp. Outline of componentsEx. 1 Ex. 2 Ex. 3 Ex. 4 Ex. 5 Ex. 6 Ex. 7 Formu- a-1 PPS 100 lation a-2PPS/PPE alloy 100 100 100 100 100 100 compo- a-3 PPS/PPE alloy nents a-4PPS/PPE alloy (parts a-5 PPS/PPE alloy by a-6 PPE/HIPS alloy weight) a-7PP/PPE alloy a-8 PA66/PPE alloy a-9 PBT/PPE alloy a-10 LCP a-11 LCP/PPEalloy b-1 GF of 13 μm b-2 GF of 6.5 μm b-3 GF of 6.5 μm 35 35 35 35 3535 b-4 GF of 17 μm c-1 Graphite of 2 μm c-2 Graphite of 5 μm 35 25 c-3Graphite of 10 μm c-4 Graphite of 20 μm 35 c-5 Graphite of 30 μm 10 c-6Graphite of 50 μm 25 c-7 Graphite of 60 μm c-8 Graphite of 130 μm 10 c-9Graphite of 20 μm d-1 Carbon fiber of 6 μm 15 5 d-2 Particulate graphiteof 20 μm d-3 Acetylene black 35 d-4 Ketjen black 4 Perfor- Surfaceresistance value (Rs): Ω 1.7 × 10⁶ 8.2 × 10⁴ 4.2 × 10² 5.4 × 10² *1 3.6× 10⁴ 5.6 × 10² mance Surface resistivity: Ω/sq. 5.1 × 10⁷ 2.5 × 10⁶ 1.3× 10⁴ 1.6 × 10⁴ — 1.1 × 10⁶ 1.7 × 10⁴ Volume resistance value (Rv): Ω8.9 × 10⁵ 4.4 × 10⁴ 1.4 × 10² 3.1 × 10² *1 6.3 × 10³ 2.8 × 10² Volumeresistivity: Ω · cm 8.9 × 10⁶ 4.4 × 10⁵ 1.4 × 10³ 3.1 × 10³ — 6.3 × 10⁴2.8 × 10³ Anisotropy (A) of resistance value 1.91 1.86 3.00 1.74 — 5.712.00 Stability (S) of resistance value 3.4 5.1 6.8 2.1 — 3.3 3.8 Perfor-Surface resistance value (Rs): Ω 7.9 × 10⁷ 4.3 × 10⁵ 7.9 × 10² 3.9 × 10²*1 3.3 × 10⁴ 6.7 × 10³ mance Surface resistivity: Ω/sq. 2.4 × 10⁹ 1.3 ×10⁷ 2.4 × 10⁴ 1.2 × 10⁴ — 9.9 × 10⁵ 2.0 × 10⁵ of re- Volume resistancevalue (Rv): Ω 3.6 × 10⁷ 2.2 × 10⁵ 3.1 × 10² 2.3 × 10² *1 5.9 × 10³ 2.9 ×10³ molded Volume resistivity: Ω · cm 3.6 × 10⁸ 2.2 × 10⁶ 3.1 × 10³ 2.3× 10³ — 5.9 × 10⁴ 2.9 × 10⁴ product Anisotropy (A) of resistance value2.19 1.95 2.55 1.70 — 5.59 2.31 Stability (S) of resistance value 3.85.5 6.1 2.4 — 3.9 4.3 Comp. Comp. Comp. Comp. Comp. Comp. Outline ofcomponents Ex. 8 Ex. 9 Ex. 10 Ex. 11 Ex. 12 Ex. 13 Formu- a-1 PPS lationa-2 PPS/PPE alloy compo- a-3 PPS/PPE alloy nents a-4 PPS/PPE alloy(parts a-5 PPS/PPE alloy by a-6 PPE/HIPS alloy 100 weight) a-7 PP/PPEalloy 100 a-8 PA66/PPE alloy 100 a-9 PBT/PPE alloy 100 a-10 LCP 100 a-11LCP/PPE alloy 100 b-1 GF of 13 μm 20 b-2 GF of 6.5 μm b-3 GF of 6.5 μm30 55 65 10 b-4 GF of 17 μm 25 c-1 Graphite of 2 μm 30 5 c-2 Graphite of5 μm 22 15 20 20 c-3 Graphite of 10 μm 15 c-4 Graphite of 20 μm 10 c-5Graphite of 30 μm c-6 Graphite of 50 μm c-7 Graphite of 60 μm 14 8 c-8Graphite of 130 μm 8 c-9 Graphite of 20 μm 13 d-1 Carbon fiber of 6 μmd-2 Particulate graphite of 20 μm d-3 Acetylene black d-4 Ketjen blackPerfor- Surface resistance value (Rs): Ω 2.6 × 10⁷ 3.1 × 10³ 4.4 × 10³2.8 × 10¹¹ 8.3 × 10³ 5.3 × 10⁸ mance Surface resistivity: Ω/sq. 7.8 ×10⁸ 9.3 × 10⁴ 1.3 × 10⁵ 8.4 × 10¹² 2.5 × 10⁵  1.6 × 10¹⁰ Volumeresistance value (Rv): Ω 1.2 × 10⁷ 1.5 × 10³ 2.3 × 10³ 1.5 × 10¹¹ 3.9 ×10³ 2.6 × 10⁸ Volume resistivity: Ω · cm 1.2 × 10⁸ 1.5 × 10⁴ 2.3 × 10⁴1.5 × 10¹² 3.9 × 10⁴ 2.6 × 10⁹ Anisotropy (A) of resistance value 2.172.07 1.91 1.87 2.13 2.04 Stability (S) of resistance value 5.6 3.1 3.74.3 3.7 4.6 Perfor- Surface resistance value (Rs): Ω 1.1 × 10⁸ 5.2 × 10⁴3.5 × 10⁴ 1.7 × 10¹² 7.3 × 10⁴ 3.9 × 10⁹ mance Surface resistivity:Ω/sq. 3.3 × 10⁹ 1.6 × 10⁶ 1.1 × 10⁶ 5.1 × 10¹³ 2.2 × 10⁶  1.2 × 10¹¹ ofre- Volume resistance value (Rv): Ω 4.8 × 10⁷ 2.3 × 10⁴ 1.8 × 10⁴ 8.8 ×10¹¹ 3.6 × 10⁴ 1.8 × 10⁹ molded Volume resistivity: Ω · cm 4.8 × 10⁸ 2.3× 10⁵ 1.8 × 10⁵ 8.8 × 10¹² 3.6 × 10⁵  1.8 × 10¹⁰ product Anisotropy (A)of resistance value 2.29 2.26 1.94 1.93 2.03 2.17 Stability (S) ofresistance value 6.2 3.7 3.9 5.2 4.5 4.9 *1: Samples could not befabricated due to insufficient fluidity, so, the measurement wasimpossible.Industrial Applicability

Molded products molded with the resin composition according to thepresent invention have a stable surface resistance value and volumeresistance value which are actually measured, both of which areequivalent to each other, in the antistatic region having a surfaceresistivity in the range of 1×10⁹ to 1×10¹⁴ Ω/sq. and the staticdissipative region having a surface resistivity in the range of 1×10⁵ to1×10⁹ Ω/sq. Further, remolded products obtained utilizing the moldedproducts also exhibit a similar noninsulating property. Therefore, theresin composition can be utilized as conductive parts in the antistaticregion and the static dissipative region in electric and electronicdevices, automobile devices, chemical devices and optical devices. Theycan be utilized, for example, as paper feeding roller bearings ofelectrostatic copying machines, paper feeding/discharging chassis ofprinting machines, gasoline and/or alcohol tank peripheral parts, ICprotecting containers (containing IC trays), exterior parts forvehicles, coil encapsulating parts, motor sealing parts and transistorpackaging parts.

The invention claimed is:
 1. A resin composition comprising: 100 parts by weight of (a) a thermoplastic resin; 20 to 80 parts by weight of (b) a nonconductive fibrous inorganic filler having an average fiber diameter of not more than 15 μm; and 10 to 70 parts by weight of the total of at least two kinds of (c) graphite having an average particle diameter of 1 μm to 50 μm wherein each kind thereof has a different particle diameter; wherein the shape of the graphite is scaly or flaky; wherein the two kinds of the (c) graphite are (c1) a graphite having an average particle diameter of from 15 μm to 50 μm and (c2) a graphite having an average particle diameter of from 1 μm to 10 μm; wherein (an average particle diameter of the (c1) component)/(an average particle diameter of the (c2) component) is from 3 to 10; wherein (a formulation amount of the (c1) component)/(a formulation amount of the (c2) component) is from 0.1 to 1.0; wherein a total amount of the component (b) and the component (c) is 30 parts by weight or more and 98 parts by weight or less; wherein component (a) is a polymer alloy comprising a matrix phase which comprises a member selected from the group consisting of polyamide, polybutylene terephthalate, and liquid crystal polymer; and a dispersed phase which comprises polyphenylene ether; and wherein both the (c1) component and the (c2) component are in the matrix phase.
 2. The resin composition according to claim 1, wherein the (a) component is a polymer alloy of polyphenylene ether and a liquid crystal polymer.
 3. A resin composition obtained by melt-kneading 100 parts by weight of (a) a thermoplastic resin; 20 parts by weight to 80 parts by weight of (b) a nonconductive fibrous inorganic filler having an average fiber diameter of not more than 15 μm; and 10 parts by weight to 70 parts by weight of the total of two kinds of (c) graphite having an average particle diameter of from 1 μm to 50 μm wherein each kind thereof has a different particle diameter; wherein the shape of the graphite is scaly or flaky; wherein the two kinds of the (c) graphite are (c1) a graphite having an average particle diameter of from 15 μm to 50 μm and (c2) a graphite having an average particle diameter of from 1 μm to 10 μm; wherein (an average particle diameter of the (c1) component)/(an average particle diameter of the (c2) component) is from 3 to 10; wherein (a formulation amount of the (c1) component)/(a formulation amount of the (c2) component) is from 0.1 to 1.0; wherein a total amount of the component (b) and the component (c) is 30 parts by weight or more and 98 parts by weight or less; wherein component (a) is a polymer alloy comprising a matrix phase which comprises a member selected from the group consisting of polyamide, polybutylene terephthalate, and liquid crystal polymer; and a dispersed phase which comprises polyphenylene ether; and wherein both the (c1) component and the (c2) component are in the matrix phase.
 4. A resin composition comprising: 100 parts by weight of (a) a thermoplastic resin; 20 to 80 parts by weight of (b) a nonconductive fibrous inorganic filler having an average fiber diameter of not more than 15 μm; 10 to 70 parts by weight of a total of at least two kinds of (c) graphite having an average particle diameter of 1 μm to 50 μm wherein each kind thereof has a different particle diameter; and at least one difference in average particle diameter between the at least two kinds thereof is not less than 5 μm; wherein a total amount of the component (b) and the component (c) is 30 parts by weight or more and 98 parts by weight or less; wherein component (a) is a polymer alloy comprising a matrix phase which comprises a member selected from the group consisting of polyamide, polybutylene terephthalate, and liquid crystal polymer; and a dispersed phase which comprises polyphenylene ether; and wherein both the (c1) component and the (c2) component are in the matrix phase.
 5. The resin composition according to claim 4, wherein the (a) component comprises an alloy of a crystalline resin and a noncrystalline resin.
 6. The resin composition according to claim 5, comprising a crystalline resin selected from the group consisting of a polyamide, a liquid crystal polymer, and a polybutylene terephthalate; and a noncrystalline resin, which is a polyphenylene ether.
 7. The resin composition according to claim 4, wherein the nonconductive fibrous inorganic filler of the (b) component is at least one species selected from the group consisting of a glass fiber, an alumina fiber, a ceramic fiber, a gypsum fiber, a potassium titanate whisker, a magnesium sulfate whisker, a zinc oxide whisker, a calcium carbonate whisker, and a fibrous wollastonite.
 8. The resin composition according to claim 7, wherein the nonconductive fibrous inorganic filler of the (b) component is a glass fiber.
 9. The resin composition according to claim 8, wherein the nonconductive fibrous inorganic filler of the (b) component is a glass fiber having an average fiber diameter of from 4 μm to 10 μm.
 10. The resin composition according to claim 4, wherein the resin composition has a surface resistivity of from 1×10⁵ Ω/sq. to 1×10¹⁴ Ω/sq.
 11. The resin composition according to claim 4, wherein the resin composition has an anisotropy of a resistance value of from 0.3 to 1.5.
 12. A molded product molded using the resin composition according to claim
 3. 13. A remolded product obtained by reutilizing a molded product molded using the resin composition according to claim
 12. 14. A resin composition comprising: 100 parts by weight of (a) a thermoplastic resin; 20 to 80 parts by weight of (b) a nonconductive fibrous inorganic filler having an average fiber diameter of not more than 15 μm; 10 to 70 parts by weight of a total of at least two kinds of (c) graphite having an average particle diameter of 1 μm to 50 μm wherein each kind thereof has a different particle diameter; and at least one difference in average particle diameter between the at least two kinds thereof is not less than 5 μm; and wherein a total amount of the component (b) and the component (c) is 30 parts by weight or more and 93 parts by weight or less. 